33N



High Performance Polyimide / E-Glass
Flame Retardant
Superior Reliability
Exceptional Thermal Performance

  • Tg Greater than 250o C
  • Non-MDA chemistry
  • Meets flammability requirements of UL94V-O
  • Meets IPC-4101 (type GIL)
  • Up to 50% reduction in cure time
  • Excellent yield on complicated multilayers
  • Low Z direction expansion

Description:


Arlon’s 33N is the next generation of polyimide materials incorporating the high performance and reliability characteristics of 31N, the toughness and ease of cure of our 76N, and flame retardant properties meeting the stringent requirements of UL94V-0. The base resin system is a pure polyimide that provides low Z-axis expansion through the most severe processes and thermal excursions, resulting in plated through hole integrity second to none. 33N is 50% tougher than conventional polyimides and is less prone to fracture during small hole drilling and profiling. 33N contains no MDA or other known potentially carcinogenic materials.



Applications:


The 33N materials are an excellent choice for many different applications. The low Z-axis expansion
improves plated through hole reliability on high layer count multilayer boards, or where very thick
(>0.093”) finished boards are needed for mechanical purposes. High copper peel strength retention allows
for multiple soldering or rework cycles, and is ideal where field repairs are required. The pure polyimide
chemistry provides the ultimate in thermal resistance for long term high temperature burn-in applications
or in down-hole environments. The low Z-axis CTE significantly improves via reliability in thermal cycling
environments.



Typical Properties: 33N Polyimide Laminate


Property Test Method Result
Peel strength lb/in elev. temp. (Kg/m) -14 MIL LAM IPC-TM-650 2.4.8 10.7 (190)
Peel after process solutions lbs./in. (Kg/m) -14 MIL LAM IPC-TM-650 2.4.8 9.0 (160)
Tg (degrees C) IPC-TM-650 2.4.24 (TMA) >250
CTE - Z axis (ppm/oC) IPC-TM-650 2.4.24 (TMA) 55
CTE - X,Y axis (ppm/oC) IPC-TM-650 2.4.24 (TMA) 16 - 17
Permitivity (1 MHz) - 8 MIL LAM IPC-TM-650 2.5.5.3 4.25
Loss Tangent (1 MHz) - 8 MIL LAM IPC-TM-650 2.5.5.3 0.009
Flammability UL94 V-0
Volume Resistivity (megohm-cm)Elev. Temp.Temp. + Humidity IPC-TM-650 2.5.17.1 7.3 x 108
7.2 x 109
Surface Resistivity (megohms)Elev. Temp.Temp. + Humidity IPC-TM-650 2.5.17.1 1.5 x 108
7.9 x 109
Flexural Strength Elev. Temp. psi (Kg/m) 31 MIL LAM IPC-TM-650 2.4.4 77.668
(5.4 x 107)
Electrical Strength -8 MIL LAM v/mil (V/mm) IPC-TM-650 2.5.6.2 1460 (5.1 x 104)
Water Absorption % -31 MIL LAM IPC-TM-650 2.6.2.1 0.32%


Typical Properties: 33N Polyimide Prepreg


Glass
Cloth Style
Arlon
Designation
IPC-4101
Classification
Resin Content
(weight %)
SCALED FLOW
Hf(mils)
SCALED FLOW
?H(mils)
106 33N0672 P41 E0106 RC SC 00 72 ± 3 1.9 ± 0.3 0.55 ± 0.20
1080 33N8063 P41 E1080 RC SC 00 63 ± 3 2.6 ± 0.3 0.55 ± 0.20
2313 33N2355 P41 E2313 RC SC 00 55 ± 3 3.6 ± 0.3 0.55 ± 0.20
2116 33N2650 P41 E2116 RC SC 00 50 ± 3 4.3 ± 0.3 0.55 ± 0.20
7628 33N2840 P41 E7628 RC SC 00 40 ± 3 6.8 ± 0.3 0.55 ± 0.20


Processing:


Process inner-layers through develop, etch, and strip using standard industry practices.
Use brown oxide on inner layers. Adjust dwell time in the oxide bath to ensure uniform coating.
Bake inner layers in a rack for 60 minutes at 225o-250oF(107o-121oC) immediately prior to lay-up.
Vacuum desiccate the prepreg for 8 - 12 hours prior to lamination.

Lamination:

  • Pre-Vaccuum for 30 - 45 minutes
  • Product heat rise = 8 - 12oF/min. measured between 150oF and 250oF(65oC and 121oC).
  • Full pressure:
    • 12 x 18 = 275 PSI (30cm x 45cm, 20 kg/cm2)
    • 16 x 18 = 350 PSI (40cm x 45cm, 25.5 kg/cm2)
    • 18 x 24 = 400 PSI (45cm x 61cm, 28 kg/cm2)
    • Note: reduce pressure by 35 - 40% with vaccum assist lamination
  • Product temperature at start of cure = 425oF (218oC)
  • Cure time at temperature = 1.5 - 2.0 hours
  • Cool down under pressure at ? 12oF(6oC)/min.

Drill at 350 SFM. Undercut bits are recommended for vias 0.018” and smaller.
De-smear using alkaline permanganate or plasma with settings appropriate for polyimide; plasma is preferred for
positive etchback.
Conventional plating processes are compatible with 33N.
Standard profiling parameters may be used; chip breaker style router bits are not recommended.
Bake for 1 -2 hours at 250oF(121oC) prior to solder to reflow of HASL.