PY260



Polyimide Laminate and Prepreg


Isola Laminate Systems offers a product line of polyimide-based prepreg and copper clad laminates
for high temperature printed circuit applications. These products consist of a flame resistance,
polyimide resin system suitable for military, commercial or industrial electronic applications
requiring superior performance and the utmost in thermal properties. They utilize a polyimide and
thermoplastic blend resin, fully cured without the use of MDA (Methylene Dianiline). This results
in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond
strength associated with traditional thermoset polyimides.


Performance and Processing Advantages

  • High Tg - 260 °C (TMA)
    • Greater thermal performance over epoxy-bismaleimide blends
  • Maintains Bond Strength at High Temperature
  • Tough Resin System
    • Improved processing due to less brittleness
    • Less delamination from machining
  • Flammability Rating V-0
  • Non-MDA (Methylene Dianiline) Chemistry
    • Meets all OSHA 1910.1050 requirements

Purchasing Information

  • Industry Approvals
    • IPC-4101A /41
    • UL Recognized – GPY, File Number E41625
  • Standard Availability
    • Thickness: 0.0025" [.05 mm] to 0.125" [3.2 mm]
    • Available in sheet or panel form
    • Copper Foil Cladding: Grade 3 (HTE), 1?2, 1 and 2 oz.
    • Foil Options: Double treat, Copper-Invar-Copper
    • Prepregs: Available in roll or panel form
    • Glass Styles: 106, 1080, 2313, 2116, and 7628

P96 Typical Laminate Properties, 0.008" [0.20mm]



PROPERTY

UNITS

Spec /41

Value

CONDITIONING

Thickness

Inches mm

0.0197[<0.50]

.008[0.20]

-

Glass Construction

-

-

2313/2116

-

Retained Resin

%

-

47

-

Thermal

Tg(DSC)

°C

250 min.

260

E-2/105

CTE x-axis

ppm/°C

-

13

Ambient to Tg

y-axis

ppm/°C

-

17

Ambient to Tg

z-axis

ppm/°C

-

60

Ambient to 28°C

Thermal Stress, 10 s @, 288°C

seconds

pass visual

NA

Condition A

Thermal Stress, 10 s @, 288°C

seconds

-

>1100

E-2/105

Electrical

Permittivity(DK)@

1MHz (2 Fluid Cell)

-

5.4 max.

4.6

C-24/23/50

500 MHz (HP 4291)

-

-

4.0

C-24/23/50

1GHz (HP 4291)

-

-

4.0

C-24/23/50

Loss Tangent(DF)@

1MHz (2 Fluid Cell)

-

0.035 max.

0.014

C-24/23/50

500 MHz (HP 4291)

-

0.012

C-24/23/50

1GHz (HP 4291)

-

0.014

C-24/23/50

Volume Resistivity

megohms-cm

1x104 min.

1.5x109

C-96/35/90

megohms-cm

6x104 min.

2.3x108

E-24/204

Surface Resistivity

megohms

1x104 min.

3.0x106

C-96/35/90

megohms

6x104 min.

2.1x108

E-24/204

Electric Strenght

volt/mil

737 min.

1424

D-48/50

[volts/mm]

[2.90x104]

[5.6x104]

D-48/50

Arc Resistance

seconds

120 min.

135

D-48/50

Comparative Tracking

volts

-

<175

ASTM D-36/38-85

Index

PLC-UL

-

4

UL 746A

Physical

Peel Strenght, RTF ½ oz.

lb/in

AABUS*

5.0

After Thermals Stress

[Kg/M]

AABUS

[90]

After Thermals Stress

Peel Strenght, Std. 1 oz.

lb/in

4.0min

7.9

After Thermals Stress

[Kg/M]

[70] min.

[141]

After Thermals Stress

lb/in

-

6.4

E-1/170

[Kg/M]

-

[141]

E-1/170

Flammability

rating

HB

V-0

UL97

Moisture Absorption

%

1.0 max.

0.40**

D-24/23


* As agreed upon between user and supplier
** Material Thickness Tested 0.028"


Pre-Conditioning Nomenclature


Letter Meaning
A No conditioning
C Preconditioning in moist
air
D Preconditioning by
immersion in H2O
des Preconditioning by drying
over a desiccant
E Preconditioning at
temperature
R Recovering 1~2 hours @
15 - 35°C &
73 - 77% RH
T Testing at a given temperature


Examples


C-96/40/92: 96 hours conditioning @ 40°C & 92% RH
D-24/23: 24 hours immersion in H2O @ 23°C
E-1/100: temperature conditioning in 1 hour @ 100°C
E-1008/100: temperature conditioning 1008 hours @ 100°C
E-1/105 + des: temperature conditioning 1 hour @ 105°C drying over desiccant
D-24/23: immersion in H2O @ 23°C for 24 hours